发明名称
摘要 <p>A daughter board/backplane assembly including a backplane having first and second surfaces and holes extending from the first surface to the second surface, pairs of separate first contacts having first ends mounted in the holes and second ends extending from both ends of the holes, the second ends of each first contact being positioned with respect to the respective surface from which it extends, and a plurality of daughter boards mounted on opposite sides of the backplane and carrying second contacts mating with the second ends of the first contacts.</p>
申请公布号 JPH028434(B2) 申请公布日期 1990.02.23
申请号 JP19870001554 申请日期 1987.01.07
申请人 TELEDYNE INC 发明人 RENAATO BOOGU JONSON
分类号 H01R24/00;H01R12/71;H01R12/72;H01R12/73;H05K3/36;H05K7/14 主分类号 H01R24/00
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