| 摘要 |
PURPOSE:To detect increase of a contact resistance between a contact plate and a contact rod, to realize stable wirebonding and to improve economy and reliability by measuring a voltage, etc., at the both ends of a detection resistance at interval time of main operation. CONSTITUTION:A gold ball formed at a point of a gold line 15 is brought into contact with an electrode 14a of a semiconductor chip 14 with a capillary 6. The capillary 6 comes into pressure-contact with the gold ball at the point of the gold line 15. A detection contact section thereby comes to a non-contact state and wire bonding process in accordance with specified conditions is started. The gold line 15 is clamped while the capillary 6 is been rising. The gold line is cut from a bonding section on an inner lead 16, the capillary 6 is further risen, the gold ball is formed at a point of the gold line 15 using an electric torch 17, and the capillary 6 is moved onto the electrode 14a next to a chip 14. These operations are discriminated by a voltmeter 21 of a detection section 20 to see if a voltage at the both ends of the detection resistance 3 is within a range of control limit voltage. |
