| 摘要 |
PURPOSE:To reduce the occupying area of mounting on a printed circuit board by disposing leads at equal intervals at crossing points of two crossing parallel line groups at 60 deg. to each other. CONSTITUTION:Leads 2 electrically connected to the electrodes of a semiconductor chip are disposed at equal intervals at crossing points of two crossing parallel line groups at 60 deg. to each other in the bottom of a hexagonal vessel 1 for sealing the chip. Even if the shape of the vessel 1 for sealing the chip is formed in a triangular shape, the arrangement is the same. Thus, the occupying area of mounting on a printed board circuit can be reduced. |
