| 摘要 |
PURPOSE:To avoid the defective bonding of a semiconductor chip and bounding created at the time of wiring by a method wherein the lower surface of the island of a lead frame is attracted and fixed by vacuum. CONSTITUTION:A semiconductor manufacturing apparatus has a fixing block 4 with which the island 2 of a lead frame 1 if brought into contact and to which the island 2 is fixed and mounts semiconductor chip 8 on the island 2. The fixing table of the manufacturing apparatus is so constructed as to include an attracting part 5 which attracts and fixed the island 2. As the island 2 is fixed by vacuum like this, no gap is formed between the island and the fixing block and bounding created at the time of wiring is avoided, and there is the advantage that stable wiring can be performed. |
