PACKAGE FOR ELECTRONIC PART,申请号JP19880200390-传众专利搜索

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发明名称	PACKAGE FOR ELECTRONIC PART
摘要
申请公布号	JPH0249454(A)	申请公布日期	1990.02.19
申请号	JP19880200390	申请日期	1988.08.11
申请人	FUJITSU LTD;SHINKO ELECTRIC IND CO LTD	发明人	HIRACHI YASUTAKA;HIDAKA NORIO;MIYAGAWA FUMIO;SAKAI HIROYUKI;TAKENOUCHI TOSHIICHI
分类号	H01L23/12;H01L23/08	主分类号	H01L23/12
代理机构		代理人
主权项
地址

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