| 摘要 |
PURPOSE:To restrict the amount of solder and attain the specified thickness of solder film accurately, by forming a solder masking film made of a material having a very weak bonding force with the solder around a junction surface of a glass medium with a converting element. CONSTITUTION:Electrodes 5 are formed at specified parts on the surface of a glass medium 3, and a low melting point metal masking film 6 is formed at both sides of junctions a, b with the converting element on the surface of the electrodes 5 respectively. The electrode 5 consists of the 1st layer made of NiCr or Cr and of the 2nd layer made of Au, Ag, Ni or Cu or their combination. The film 6 is formed by attaching a metal which is hardly bonded with the solder such as Al, Cr, Ni and Cr on the surface of the electrodes 5 by vapor-deposition or the like. |
