| 摘要 |
PURPOSE:To efficiently realize attachment of pellet with high reliability by dicing a wafer at each insulating plate in a state that the plate covers to the rear face of the wafer, and pellet-bonding inner leads, tabs or the mounting position of a package substrate in this state as it is. CONSTITUTION:A semiconductor pellet 10 is cut in a state that an insulating plate 2 covers at the rear face side if a wafer 1 having a circuit forming face on one side face, and the pellets are bonded to the mounting positions in a state that the plate 2 covers. Thus, the pellet 10 having the plate on its rear face can be easily obtained, and a pellet bonding work can be efficiently performed with high reliability without addition of the mechanism of a device or large alteration of steps. |
