PROCESSO DE SOLDAGEM DOS FIOS DE CONEXOES EXTERIORES SOBRE UM COMPONENTE ELETRONICO

摘要

According to the disclosed method for the soldering of wires of components, at least one wire is stamped to make it lose its symmetry of revolution. The result thereof is one or more impressions. A solder strip is crimped by deformation around the wire to form a solder preform held still by the impressions, which leaves free a surface of the wire. The component to be soldered, held against said surface of the wire, is soldered by reflow process. Application: the soldering of components such as disk ceramic capacitors.