发明名称 RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
摘要 PURPOSE:To obtain the subject resin composition with low stress excellent in thermal shock and solder heat resistance by blending a modified epoxy resin with a bismaleimide compound, phenol-aralkyl resin and/or resol-aralkyl resin and inorganic filler. CONSTITUTION:(A) A modified epoxy resin containing uniformly dispersed silicone polymer with <=1mum particle size prepared by additional reaction of an addition reaction type silicon polymer in the presence of a graft polymer between an epoxy resin and a vinyl polymer or by polymerization of a vinyl- modified silicone with another arbitrary monomer, (B) a bismaleimide of the formula (R is >=2C divalent organic group), (C) a phenol-aralkyl resin and/or resol-aralkyl resin and (D) an inorganic filler are blended as the main components in such a ratio that (B) is 30-80wt.% of the total composition, (C) 10-500 pts.wt. based on 100 pts.wt. (B), (A) 0.1-10 equivalent ratio based on (C) and (D) 100-600 pts.wt. based on 100 pts.wt. composition, thus obtaining the subject resin composition for sealing semiconductors.
申请公布号 JPH0241353(A) 申请公布日期 1990.02.09
申请号 JP19880190710 申请日期 1988.08.01
申请人 MITSUI TOATSU CHEM INC 发明人 MACHIDA KOICHI;KITAHARA MIKIO;KUBO TAKAYUKI;TORIKAI MOTOYUKI;ASAHINA KOTARO
分类号 C09K3/10;C08G59/00;C08G59/14;C08G59/32;C08G59/34;C08G59/40;C08G59/62;C08L51/08;C08L63/00;H01L23/29;H01L23/31 主分类号 C09K3/10
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