| 摘要 |
<p>PURPOSE:To cope with the variable size of electronic parts by providing a die ejector equipped with a plurality of die ejectors and selectively moving each die ejector to a pushing up position in corresponding to the size of the parts. CONSTITUTION:When electronic parts P on a water 6 are small in size, a die ejector 21 provided with a smaller pepper pot 24 is used. In this case, the die ejector 21 on one end is moved to a pushing up position below the wafer 6 by sliding a slider 34. When the die ejector 21 is moved, the upper surface of the pot 24 is brought into contact with the lower surface of a wafer sheet 6a by driving an elevating device 37 and the parts P are pushed up by projecting a pin 30. When the parts P are large in size, on the other hand, another die ejector 22 equipped with a larger pepper pot 39 is moved to the pushing up position by sliding the slider 34. When this device is used, therefore, the optimum die ejector can be used selectively by moving the ejector to the pushing up position.</p> |
