Dipping process and appliance for electrolytic coating of boards, especially of electrical printed circuit boards

摘要

A dipping process for the electrolytic coating of stationary boards (13) is described. Coating takes place in a tank (1) which is filled with an electrolyte and dipping into which there are at least one anode (5) and, at a distance from the latter, the cathodically poled boards (13). On the surface of the latter there is generated, by electrolyte jets directed against the boards (13), an electrolyte flow by which the metal is not deposited simultaneously on all the cathodically poled regions of the boards (13), but is deposited repeatedly in regions migrating across the boards (13). In the process, the electric field prevailing between the anodes (5) and the boards (13) is attenuated or completely blanked out (masked out), with the exception of a region co-migrating with the electrolyte jets.