| 摘要 |
PURPOSE:To improve connecting reliability by so forming a conductor pattern formed to be soldered and containing as a main ingredient silver-palladium alloy of relatively high palladium content on a ceramic board as to cover the part of the pattern formed for wirings having relatively low palladium content. CONSTITUTION:A conductor pattern for wirings of silver-palladium (Pd-Ag) alloy containing 10-20% or preferably approx. 50% of palladium (Pd) is printed and formed on a ceramic board 1 made of alumina (Al2O3) by a screen printing method. Then, a conductor pattern 20 to be soldered of silver-palladium (Pd-Ag) containing 25% or more of palladium (Pd) such as approx. 30% is so printed and formed by a similar method as to cover the part of the pattern 10, and sintered at 800-900 deg.C. Thereafter, a glass material 30 made of SiO2 (32%)-PbO (42%)-B2O3 (5.5%)-ZnO(5%)-Al2O3 (6.5%)-CaO (9%) is so printed and formed by a screen printing method as to cover the conductor connection part, and sintered at 500-600 deg.C. |
