发明名称 METHOD AND DEVICE FOR POLISHING
摘要 PURPOSE:To remarkably improve a polishing efficiency by performing the polishing by a free abrasive grain in the state of embrittling a crack by generating it on the surface by the abrupt heating and cooling of the time of radiating a laser light on the hard brittle material of a ceramic, etc. CONSTITUTION:A laser light 4 is irradiated on the body 1 to be worked which is dipped in the polishing liquid 23 contg. a free abrasive grain and a crack is generated a lot by the rapid heating and cooling actions due to a laser spot on the face 25 to be worked of the body 1 to be worked. As a result, the surface layer part of the body 1 to be worked is embrittled. A rotary shaft 13 is then descended in an arrow mark 15a direction and the face to be worked embrittled with the generation of the crack is polished with good efficiency by the cooperation action of a polishing cloth 12 and the free abrasive grain inside the polishing liquid 23 by pressurizing the polishing plate 11 via the polishing cloth 12 and rotating the rotary shaft 13 in an arrow mark 14 direction.
申请公布号 JPH0236067(A) 申请公布日期 1990.02.06
申请号 JP19880183507 申请日期 1988.07.25
申请人 TOSHIBA CORP 发明人 TAKAMATSU KOJI;UEDA KATSUNOBU
分类号 B24B37/00 主分类号 B24B37/00
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