| 摘要 |
<p>PURPOSE:To make possible the use of low-cost and very general lead frames without needing a high-accuracy precise circuit board by a method wherein a sealing resin and the lead frames are combined with each other in such a way that a difference in the linear expansion coefficient between the sealing resin and the lead frames comes to 7X10<-6>/ deg.C or less. CONSTITUTION:A plating of gold or the like is applied to lead frames 40 formed in a prescribed configuration to use the surfaces on one side of the frames 40 as terminals 40a for external connection use, an integrated circuit element 50 is die bonded on the surfaces 40b on the other side and the surfaces 40b on the other side and connecting pad parts of the element 50 are connected to each other by bonding wires 60 consisting of a material of gold, Al, copper and so on. After the necessary connection between the element 50 and the frames 40 is performed, the element 50 is covered and protected with a sealing resin 70 by a transfer molding method using a molding material of an epoxy and so on. By combining the frames 40 with the resin 70 in such a way that a difference in the linear expansion coefficient between the frames 40 and the resin 70 comes to 7X10<-6>/ deg.C or less, the deflection of the integrated circuit element is restrained to 50mum or less and the dimensional accuracy and mechanical strength of the element can be improved.</p> |
