HEAT SINK, PARTICULARLY FOR COOLING ELECTRONIC COMPONENTS

摘要

In a heat sink (1), particularly for cooling electronic components (4), having a base body (2) on which the components (4) and a heat-removing cooling element (3) are adjacently situated, an increase in the heat transfer surfaces with respect to the overall volume of the cooling element (3) and a higher cooling capacity resulting therefrom are achieved in that the cooling element (3) is designed as an array of ribs consisting of a multiplicity of metal sheets (6). The metal sheets (6) are arranged essentially parallel and at a mutual spacing determined by the plate density of the array of ribs. The metal sheets (6) are materially joined to one another at one of their long sides (7) and the array of ribs (cooling element 3) is materially joined to the base body (2). This design of the heat sink (1) makes possible an individual configuration of the cooling element (3) for the purpose of optimum removal of the heat produced by the components (4). ……