| 摘要 |
PURPOSE:To obtain a device provided with a package wherein the occupied area at the time of mounting is small and many terminals can be arranged, by leading out a plurality of leads to connect a semiconductor chip contained in a package with a mounting substrate, on one side surface of the package, and bending the tips so as to be arranged on the same plane rectangular to the leading-out direction. CONSTITUTION:A plurality of internal wiring pattern 21 or leads 61 to connect a semiconductor chip 1 contained in a package 2, 6 with a mounting substrate are led out on one side surface of the package 2, 6, in the direction parallel to the main surface of the semiconductor chip 1. The tip parts are bent so as to be arranged on the same plane rectangular to the leading-out direction, and connection pads 21b or connection terminals 61a are formed. For example, in the case of an LCC type package, two rows of connection pads 21b for surface mounting are arranged in zigzag, on one side surface of the ceramic package 2. The connection pads 21b are formed by plating gold on a nickel base after tungusten paste is stuck and brazed in a specified pattern. |
