| 发明名称 |
HEAT CURABLE SILICONE POLYIMIDE COMPOSITIONS |
| 摘要 |
<p>RD-15,918 HEAT CURABLE SILICONE POLYIMIDE COMPOSITIONS Silicone polyimides can be used as a one or two package heat curable composition when cured by silicon vinyl silicon-hydride addition with a cyclometallized platinum phosphite catalyst.</p> |
| 申请公布号 |
CA1265279(A) |
申请公布日期 |
1990.01.30 |
| 申请号 |
CA19860519472 |
申请日期 |
1986.09.30 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
KEOHAN, FRANCIS L.;LEWIS, LARRY N. |
| 分类号 |
C08L83/10;(IPC1-7):B05D3/02 |
主分类号 |
C08L83/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
