| 摘要 |
PURPOSE:To facilitate the isolation of laminated semiconductor wafers by a method wherein semiconductor wafers are immersed in liquid which is fed with high-frequency oscillation so that the wafer on the topmost part may be shifted to be isolated from the second wafer and so forth. CONSTITUTION:When laminated substrates 5 are immersed in a vessel 13 filled with water to be fed with ultrasonic by a high-frequency generator 14, water 3 permeates gaps between closely adhered wafers 5 to isolate respective wafers 6 from one another. Next, when a roller 28 is rotated in the arrow F direction with the surface 5a of wafer 5A on the topmost part brought into contact with a roller 28, the wafer 5A on the topmost part starts shifting in the arrow G direction. Furthermore, the wafer 5A shifts in the arrow G direction on an isolating guide 21 to be carried to an isolating part corresponding to the rotation of the roller 28 in the arrow F direction. Through these procedures, only one each of the semiconductor wafer on the topmost part can be isolated easily and without fail.
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