| 摘要 |
PURPOSE:To form a uniform plating layer on the surface of a copper mold at a high speed when the surface of the mold for a continuous casting apparatus is plated with a metal, by narrowing the interval between the mold as the cathode and the anode and supplying electric current at a high current density while feeding a plating soln. between both the electrodes at a high velocity. CONSTITUTION:When a metal plating layer is formed on the surface of a Cu plate 4 for a continuous casting mold used in an apparatus for continuously casting a molten metal, a Ti or Pt clad insoluble electrode as the anode 6 is put in a plating vessel 7 and the Cu plate 4 as the cathode is set over the anode 6 at a narrow interval, e.g., of 10-15mm. While a plating soln. in a plating soln. vessel 1 is circulated by passing through the narrow path 5 between the electrodes 4, 6 by a pump 2 at >=1m/sec velocity and by returning to the vessel 1 through a pipe 8, electric current is supplied between the Cu plate 4 as the cathode and the anode 6 at a high current density, e.g., of 10-50A/dm<2> to form a uniform plating layer on the surface of the Cu plate 4 at a high speed. |
