| 摘要 |
<p>PURPOSE:To make recessed parts provided in a sealing resin decrease stress which is exerted to a semiconductor chip and improve the reliability of a resin sealed type semiconductor device by providing recessed parts at least on an upper surface of a sealing resin substance which lays the semiconductor chip in the resin as well as at least at a part of the inside part above the semiconductor chip. CONSTITUTION:A semiconductor chip 10 which is 8mm square is connected to a lead frame 30 electrically through a bonding wire 20 and recessed parts 53 and 63 are formed by machining at parts located in the inside regions of a sealing resin 40. Each recessed part is dimensioned as 7.5X7.5X1mm and it reduces the volume of the sealing resin 40 on the semiconductor chip 10 to half approximately. Such a state of the sealing resin allows shrinkage stress of the above sealing resin 40 on the semiconductor chip 10 to be relieved and the movement volume of wiring in the square of the semiconductor chip 10 is reduced to one-thirds. The decrease in this stress prevents the semiconductor chip from being damaged. It is needless to say that the above mentioned effect is obtained if the recessed part is mounted at least on the chip side, that is, on the upper surface of the chip.</p> |
