| 摘要 |
PURPOSE:To prevent the surface of a wafer from contaminating with powder dust generated in case of marking with a diamond tool by selectively enclosing the tool and the surface of a semiconductor with a predetermined quantity of liquid substance having high viscosity, and marking it in the substance. CONSTITUTION:A diamond tool 24 and the surface of a wafer 21 are selectively enclosed with a predetermined quantity of liquid substance 2 having high viscosity, and marked therein. After powder dust 3 generated in case of marking with the tool 24 is so enclosed as not to be scattered into the substance 2, the substance 2 for enclosing the dust 3 is dried, semisolidified, and the semisolidified substance is peeled and removed from the wafer 21. The substance 2 is composed, for example, of silicone resin having high viscosity, epoxy resin or photosensitive resin. Thus, the contamination of the surface of the wafer with the dust generated in case of marking it with the tool can be substantially completely prevented.
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