发明名称 |
A SEMICONDUCTOR INTEGRATED CIRCUIT WITH TEMPERATURE SENSOR |
摘要 |
<p>An integrated circuit is formed in a semiconductor die having a front face and a back face, the die having at least first and second functional regions. The first functional region comprises at least one zone of p-type material and at least one zone of n-type material that meets the zone of p-type material in a p-n junction. The integrated circuit comprises connection pads connected respectively to the zone of p-type material and the zone of n-type material, whereby those zones can be connected to an external circuit. At least one of the connection pads is electrically isolated from the second functional region of the integrated circuit. The integrated circuit is treated by mounting the die on a support member and removing material of the die so as to separate the functional regions of the die from each other.</p> |
申请公布号 |
GB2221092(A) |
申请公布日期 |
1990.01.24 |
申请号 |
GB19890016331 |
申请日期 |
1989.07.17 |
申请人 |
* TEKTRONIX INC |
发明人 |
MORLEY M * BLOUKE;BRIAN L. * CORRIE |
分类号 |
H01L21/339;H01L27/02;H01L27/146;H01L27/148;H01L29/762 |
主分类号 |
H01L21/339 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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