发明名称 SPUTTERING DEVICE
摘要 PURPOSE:To provide the target and cathode free of an abnormal discharge by engaging shield members with a step provided on the periphery of the sputtering target at regular intervals to avoid the deposition of the spattered particles on the opening of the shield member. CONSTITUTION:A step with the protruding central part is provided on the whole periphery of the upper surface of a sputtering target 1, and the shield members 2 for limiting the sputtering region are engaged with the step of the target 1 at intervals of about 2mm. At this time, the upper surface of the shield member 2 is made flush with or lower than the upper surface of the target 1. The target particles spattered from the upper surface of the target 1 are deposited by this sputtering device. Although the particles are spattered radially upward from the upper surface of the target, the spattered particles are not deposited on the member 2, because the upper surface of the member 2 is not higher than the upper surface of the target 1.
申请公布号 JPH0219461(A) 申请公布日期 1990.01.23
申请号 JP19880169424 申请日期 1988.07.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KITAMOTO MIKIO;OTA TAKEO;INOUE ISAMU;AKIYAMA TETSUYA;ISOMURA HIDEMI
分类号 C23C14/34 主分类号 C23C14/34
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