| 摘要 |
PURPOSE:To automate a deburring process by a method wherein a lead frame with its sides burred is transmitted to be pressed to the points of deburring tools. CONSTITUTION:A resin-sealed body 4 containing a semiconductor element is formed on a lead frame 2. The frame 2 has burrs 6 on its sides. The frame 2 is pressed and held in grooves 10a of grooves rolls 10 and is inserted between belts 11 or the like when it is transmitted. The burrs 6 are under pressure exerted by the grooves 10a of the rolls 10. The lead frame 2 comes out of the pressing section and the burred sides thereof meet the points 12a of the rotatably provided deburring tools 12 for deburring. |
