| 摘要 |
<p>PURPOSE:To enable an IC module 24 to be fixed highly precisely by a method wherein an IC module and a card base material come into contact with each other near a center in a vertical direction of an opening part, and they are separated by an inclined clearance narrowing toward the center near a front surface or a rear surface. CONSTITUTION:An inclined outside surface 7 of which an outer form grows larger from a surface to a center in a vertical direction is formed to an IC module 5, and a projection part toward an inner side surface of an opening part is formed at the center part in the vertical direction thereby. When an IC chip and other components are sealed with resin by a transfer moulding, it can be easily moulded by sloping an inside surface of a metal mould. Since this IC module 5 has almost the same thickness as a card base material 4, when the module 5 is inserted into the opening part of the card base material 4 referring to its base surface, the vertical center part of the IC module 5 of which the outer form grows largest conforms to the vertical center part of the card base material 4. The IC module 5 comes into contact with the card base material 4 near the center, and is fitted into the opening part in a state incapable of being displaced.</p> |
