| 摘要 |
PURPOSE:To increase the contact area of low melting-point glass, and to reduce defective leakage by installing pressure relief structure to a semiconductor package cover and making internal pressure at a time when the cover is fast stuck release outside. CONSTITUTION:A ceramic package 1 is formed of a package body 2, a chip 8 welded through a solder material 9, aluminum wirings 7, low melting-point glass 6 bonded on the four sides of a package cover 3, a transparent glass window 4, leads 10, etc. Pressure relief structure 5 is mounted to the cover 3 in the constitution. When the cover 3 is contact-bonded with the body 2, internal pressure rises. The pressure relief structure 5 is indented and the pressure rise is absorbed. Accordingly, the rise of the internal pressure is relaxed, the contact area of the low melting-point glass 6 is increased, and defective leakage is reduced. |
