发明名称 TUNGSTEN METALLIZING STRUCTURE OF ALN BODY
摘要 PURPOSE:To improve the bonding strength of the title metallizing structure to AlN by forming a layer consisting of W and the material having the same composition as AlN in a specified ratio between the AlN body and the W layer formed thereon. CONSTITUTION:The tungsten metallizing structure is composed of the first layer consisting of 35-90wt.% of the material having the same composition as an AlN body and 10-65wt.% W on the AlN body and the second layer of W thereon. When the metallizing layer is formed, an additive having the same composition as the AlN body is mixed into a first tungsten paste, and the AlN body is metallized with the paste to bond the first tungsten layer firmly to the AlN body. The second metallizing layer capable of being firmly bonded to the metallizing layer and consisting of W is further formed on the metallizing layer.
申请公布号 JPH0218371(A) 申请公布日期 1990.01.22
申请号 JP19880167055 申请日期 1988.07.05
申请人 MURATA MFG CO LTD 发明人 KATOU TAKEYUKI;YONEDA YASUNOBU;SAKABE YUKIO;NAGAI AKIRA
分类号 C04B35/581;C04B41/89;H05K1/09;H05K3/24 主分类号 C04B35/581
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