| 摘要 |
PURPOSE:To contrive the improvement of smoothness of the whole surfaces of the chamfering parts of semiconductor wafers by a method wherein a plurality of sheets of the semiconductor wafers subjected to a mechanic chamfering processing after a lapping process or an entire surface etching process are pinchingly laminated, the laminated material is dipped into an etching liquid and the chamfering parts only are etched. CONSTITUTION:A laminated material X is placed and clamped between a fixed supporting wall 8 and a movable pressing wall 10 of a clamping device Y and is dipped into an etching liquid W in a container H in a state that semiconductor wafers 2 are adhered closely to one another. In this state, as chamfering parts 12 only of the wafers 2 are exposed in the liquid W, the parts 12 only result in being etched as shown by dotted lines, for example. Parts, which are adhered closely to one another, of the wafers 2 are never subjected to etching as never coming into contact with the liquid W. In such a way, the parts 12 only of the wafers 2 are etched.
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