| 摘要 |
PURPOSE:To prevent a crack from occurring and to eliminate the loss of a role of a protective film by forming the corners of the inner peripheral edges of an opening of the film at an obtuse angle or in a circular-arc state or in a circular state in a semiconductor device formed with the opening at the film and sealed with resin. CONSTITUTION:Openings 4 are formed at the upper protective film 2 of a bonding pad 3 formed on the periphery of the surface of a semiconductor chip 1. The opening 4 of the film 2 is so formed of vertical inner peripheral edge 4a, horizontal inner peripheral edges 4b and oblique inner peripheral edges 4c that all the corners 5 have obtuse angles and so composed that an angle theta1 formed between the edge 4a and the edge 4c and an angle theta2 formed between the edge 4b and the edge 4c become 135 deg.. Thus, since no corner of a right angle or an acute angle is presented in the opening 4 of the film 2 laminated on the chip 1, it can prevent a stress from concentrating at the corner, thereby dispersing the stress. |
