发明名称 POWER DEVICE
摘要 <p>PURPOSE: To enhance electric insulation by a structure wherein a mold package is provided with a recess arranged with the interrupting points of a supporting member for an inner metallic board until the mold package is formed and the interrupting points are arranged at the innermost part in the recess. CONSTITUTION: Each lateral beam 16 of a lead frame 10 has one side face constituting a supporting part for pins or the constricted end part of terminals 21, 22, 23 and 24 and the opposite side face constituting the supporting tabs 26, 27 for a metallic board 28, and its projected region constitutes a die chip pad 29. Interrupting part 31 of each tab 26, 27 is formed one half time as thick as the tab 26, 27. A transfer mold package 32 is provided with notches 36, 37, each including the interrupting part 31 of the tabs 26, 27 and the interrupting points of interrupting parts 31 are arranged in the rear of the notches 36, 37. According to the arrangement. The arc part is elongated significantly and it can be controlled easily by selecting the dimensions of the notches 36, 37.</p>
申请公布号 JPH0210878(A) 申请公布日期 1990.01.16
申请号 JP19890085625 申请日期 1989.04.03
申请人 SIEMENS AG 发明人 RIN KAARU UIIZE
分类号 H01L23/48;H01L23/31;H01L23/62;H01L31/12;H01L31/167;H03K17/78 主分类号 H01L23/48
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