| 摘要 |
PURPOSE:To eliminate breakdown of print circuit during die releasing of a formed board by forming a conductor metal layer through electrolytic plating at a conductive section of a plating formation film, forming a board using a special forming die and removing a formed board from a forming die together with the conductor metal layer which is joined to the formed board in one-piece structure. CONSTITUTION:A conductive section 22 is connected to a rear side of an insulating section 21. A conductive material such as Cr which can be easily removed when a conductor metal layer is transcribed to a formed board is used for the conductive section 22. A plate forming film 20 is fixed to a surface of a forming die 10 through an adhesive, etc., and a conductor metal layer 30 is formed to the conductive section 22 by electrolytic plating. The forming die 10 whereto the conductor metal layer 30 is formed is fixed to a forming device 40, and then a forming cavity 13 is constituted which is relevant to an outer shape of a board together with an inner surface of a forming die 41 which is different from a surface whereon the conductor metal layer 30 is formed. Board material forming resin such as epoxy resin is introduced into the forming cavity 13 for formation. A formed board 50 is formed corresponding to a shape of the forming cavity 13 and the conductor metal 30 is incorporated into a solid surface of the formed board in one-piece structure. |
