| 摘要 |
PURPOSE:To surely mount an electronic component on a circuit board by air suction by a method wherein an outer packaging resin coated on an element is pressurized in a semi-hardened state, flat faces are formed on both sides in order to simply form the flat faces on an outer package. CONSTITUTION:The outside of an element 12 to which a terminal 11 has been attached is coated with a molten resin; an outer packaging resin 13 is formed; the outer packaging resin 13 in a semi-hardened state is pressurized from wide-width faces in both sides by using one pair of pressing members 14, 14; flat faces 15, 15 which are parallel are formed on both sides of the outer packaging resin 13. Then, the outer packaging resin 13 is heated and hardened; a wax is sucked into the outer packaging resin 13 in order to secure a vibrating space. After the outer packaging resin 13 has been hardened, the terminal 11 is bent in such a way that one flat face 15 and the terminal 11 are situated on a nearly identical plane in order to easily mount an electronic component 16 on a circuit board. Since the flat faces 15, 15 are formed on both faces of the outer packaging resin 13 in a parallel state, the electronic component 16 can be stuck surely by using a suction tube 18; in addition, a mounting state on a circuit board 17 is stabilized; the electronic, component 16 can be mounted automatically by air suction. |
