| 摘要 |
PURPOSE:To prevent a dielectric breakdown effectively and moreover to improve a device of this design in reliability and yield by a method wherein a conductive material, which has a conductivity to such an extent that it does not deteriorate an electrical property of a semiconductor chip, is employed as a sealing substance. CONSTITUTION:For instance, plastic, to which a conductive material such as carbon or the like is added, is used as a sealing material 15 and adjusted to be 10<12>-10<11>OMEGA or so in resistivity. When a semiconductor device is placed in an strong electric field, an electric field is not induced in the sealed inside, because a semiconductor chip is sealed up with a conductive material. On the other hand, considering a case that the semiconductor device is charged at handling or at a sealing process, the charge is distributed on the surface of a lead and a sealed section and discharged outside through them, so that the charge of a lead 14 can be restricted to be small in volume. And, a conductive material of comparatively high resistivity is used as a sealing material 15, so that a leakage current does not occur between the leads 14 under a normal condition and a current flows through the semiconductor chip 11 side passing through the lead 14 and a bonding wire 13. |
