| 摘要 |
<p>PURPOSE:To prevent an insulation failure caused by a concave resin occurred at a resin injecting hole by a method wherein a through-hole, which serves as a relief hole of a screw and a semiconductor element protective resin injecting hole, is connected to a hole, possessed of a screw function, inside a case. CONSTITUTION:A relief hole 11 of a screw, which is screwed into a nut 9 fitted to a nut hole 31 of a resin upper lid 3, is formed as a through-hole. A gel material 12 and an epoxy reins 13 are injected taking advantage of the above the through-hole before the fitting of the nut 9 into the nut hole 31, the bending of a lead-out terminal 5, and a heaping process of an external conductor 8. The epoxy resin 13 is injected to such an extent that it reaches slightly above the lower end of the relief hole 11 and set after the gel material 12 is injected until it covers as Al wiring 7. If the epoxy resin 13 is injected too much, the resin 13 may bear on the tip of the screw shown by an axial line 10. In result, the height of the gel material 12 and the epoxy resin 13, to be injected, becomes low, so that the epoxy resin is especially saved in quantity.</p> |
