Wrapping member for semiconductor device and method for manufacturing the wrapping member.

摘要

A wrapping member for holding semiconductor devices comprises a carrier tape (1) and a seal tape (2). The carrier tape (1) is embossed to form depressed portions, each of which is adapted to receive one semiconductor device. The seal tape (2) is adhered to the carrier tape (1) in a manner to successively cover the depressed portions. A thin metallic film is formed on the surface of at least one of the carrier tape (1) and the seal tape (2).