| 摘要 |
PURPOSE:To disperse a stress, which is generated in a molding resin, and to inhibit the generation of cracks by a method wherein a semiconductor chip is covered with a coating material of a low stress and at the same time, the outside of this semiconductor chip is molded with the resin formed into a similar figure similar roughly to the surface configuration of the coating material and a package is constituted. CONSTITUTION:A semiconductor chip 2 is mounted on a chip mounting part 1a of a lead frame 1 and is electrically connected to outer lead parts 1b by bonding wires 3. A drip coating material 4 of a low stress is dripped and applied on the mounting part 1a in such a way as to cover the surface of the chip 2. Moreover, a molding resin 5 is molded in such a way as to include the material 4, the wires 3 and part of each outer lead part 1b and a package is constituted. The upper external shape of the resin 5 is formed so as to become a rough similar figure having the same center as that of the surface configuration of the material 4 and the thickness of the resin 5 is formed in such a way as to become uniform. Thereby, even if a stress is grown in the resin 5 under a high-temperature environment, the generation of a crack can be inhibited. |
