| 摘要 |
PURPOSE:To plan to enhance manufacturing yield by enlarging a contact area for its area at the time when a wiring free space of specified area or more exists on the circumference of a minimum contact area for connecting one of wiring layers insulated mutually to the other thereof. CONSTITUTION:A wiring treatment of all signal wires in performed and a wiring condition treatment and a shape modifying treatment are executed as the wiring result thereof. In other words, it is judged whether the investigation of the circumference of whole contact is executed, unexamined contacts are detected if they are not performed and a modifying treatment is executed so as to enlarge its contact area if there is an unused area larger then a predetermined area on the circumference of the detected contacts. Here a wiring condition investigation part examines whether there is a signal wiring on the upper and lower parts, the righthand and lefthand parts of a window, in this case signal wiring of a first wiring layer exists on the upper side and that of a second wiring layer passes on the righthand and lefthand sides, but the lower side is an unusual area. When the unused area is detected, it proceeds to next shape modifying part and one window is added to the contact of one window to get two windows. |
