SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To make larger an exposed surface of an uppermost layer laminated bonding pad of a semiconductor device where a wiring part is arranged into a multilayer, by laminating in a flat lower layer bonding pad the upper layer pad of the same area or more. CONSTITUTION:A first layer bonding pad 6 of a lower layer wiring part of a multilayer interconnection part is formed on an insulating film 10 on an insulating substrate 1 so as to be planar with an insulating filler 40 and an insulating film 20. An uppermost layer wiring part pad 7 the same in area as the pad 6 or larger is laminated on the pad 6 to increase an exposed area of the pad 7 through the insulating filler. Hereby, wiring to the overlapped pad of the multilayer interconnection part can be facilitated.