| 摘要 |
PURPOSE:To improve circuit precision, by a method wherein, after a first etching is progressed up to a conventional conductor thickness, and a resist film is so formed by screen printing that the resist film is formed on also the side wall of a left circuit forming part, a second and the following etching is performed. CONSTITUTION:For the conductor 2 of a substrate 1 with a thick conductor plate wherein the conductor 2 of 200mum or more in thickness and a base substrate 4 are laminated in a body, the following is performed in two or more stages; the forming of a resist film 5 by screen printing using resist ink etching the exfoliating of the resist film 5. As to a second and the following formation of the resist film 5, the printing width of a printing matrix in the second stage is widened so as to cover the plane and the side wall of a circuit forming part 2a left by the preceeding etching, and drying etching the exfoliating of the resist film 5 are repeated. As a result, if the conductor thickness increases, the precision of circuit formation can be always maintained in the same range as the case where the conductor thickness is about 100mum. Thereby, a thick plate conductor circuit of high precision can be formed. |
