| 摘要 |
A process is described for making metallized holes in a dielectric substrate (1) which, after galvanic growth of the conductive paths (6, 7) delimited by photoresist (5) on the substrate (1), calls for a drilling phase of the substrate (1) and electrogalvanic creation of rivets (11) protruding beyond the edges of the holes (9) on the front of the substrate (1). Then follow the phases of completion of the conductive and resistive paths (13, 14; 15, 16) on the front, deposition of metals (17) on the back, reinforcement of the rivets (11) and galvanic growth of the back and of the metals (17) deposited inside the holes (9). |
