| 摘要 |
<p>PURPOSE:To shorten the interval between semiconductor chips without requiring a bonding electrode therebetween for making a smaller semiconductor device, by directly connecting the electrodes of each semiconductor chip arranged close on a substrate to each other with metal wires. CONSTITUTION:The electrodes 6 and 7 of respective semiconductor chips 4 and 5 arranged close on a substrate 1 are directly connected to each other with a metal wire 9. For example, conductive paste is printed by thick film screen printing on the upper surface of the insulating substrate 1 made of alumina ceramic, dried, and baked to form the wiring patterns 2 of a circuit. Then, conductive paste is printed also by thick film screen printing, dried, and baked to form bonding electrodes 3. IC chips 4 and 5 are mounted on the upper surface of the insulating substrate 1 with bond 10 and heated to harden said bond 10. The aluminum electrodes 6 and 7 of each IC chip 4 and 5 are connected to the bonding electrodes 3 with metal wires 8, and then the aluminum electrodes 6 and 7 of respective IC chips 4 and 5 are connected with each other with a metal wire 9.</p> |
