发明名称 Method of making a semiconductor memory device with recessed array region
摘要 A semiconductor memory wherein a memory cell region having a plurality of memory cells and has higher altitude from the surface of semiconductor substrate is formed in the recessed part of semiconductor substrate having the recessed part and projected part and a peripheral circuit region which is comparatively low from the surface of semiconductor substrate is formed to the projected part of semiconductor substrate.
申请公布号 US4882289(A) 申请公布日期 1989.11.21
申请号 US19880184786 申请日期 1988.04.22
申请人 HITACHI, LTD. 发明人 MORIUCHI, NOBORU;YAMAGUCHI, YOSHIKI;TANAKA, TOSHIHIKO;HASEGAWA, NORIO;KAWAMOTO, YOSHIFUMI;KIMURA, SHIN-ICHIRO;KAGA, TORU;KURE, TOKUO
分类号 H01L21/302;H01L21/3065;H01L21/8234;H01L21/8242;H01L27/088;H01L27/10;H01L27/105;H01L27/108 主分类号 H01L21/302
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