发明名称 MANUFACTURE OF PRINTED-CIRCUIT BOARD
摘要 PURPOSE:To enhance the bonding strength of a surface pattern and to shorten the time for an etching treatment used to form the surface pattern by a method wherein a conductor foil of a mat face where an uneven part is left only in a part to be used as the surface pattern is pasted to a surface where an inner- layer member and an adhesive sheet have been laminated. CONSTITUTION:A conductor foil 1 where an uneven part used to obtain an appropriate bonding force has been formed on a mat fade 1a is cut to a prescribed size and a photoresist 16 is coated on the mat face 1a; a pattern 11-2a corresponding to a surface pattern is printed. In addition, a part other than the pattern 11-2a is removed by a developing treatment, the uneven part is made smooth by a slight etching treatment and the photoresist 16 is removed chemically. A conductor foil 11 having an uneven part only in the part of the pattern 11-2a is formed in this manner and is used as a surface where an inner- layer member and an adhesive sheet have been laminated. By this setup, the bonding strength between a surface pattern 7 and the adhesive sheet is increased and the etching treatment time can be shortened.
申请公布号 JPH01289293(A) 申请公布日期 1989.11.21
申请号 JP19880120952 申请日期 1988.05.17
申请人 FUJITSU LTD 发明人 YAMASHITA MITSUO;FUJITA YUKIO
分类号 H05K3/06 主分类号 H05K3/06
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