| 摘要 |
PURPOSE:To produce a high-quality target having excellent adhesive strength without allowing oxides and holes to exist on joint surfaces by joining a target plate for forming a thin film of ITO (indium tin oxide) to a backing plate while floating said plate within the surface layer part of an In bath at the time of joining the above-mentioned target plate to the backing plate. CONSTITUTION:The backing plate 2 is immersed into molten In 10 in a bath tank 4 and the target plate 1 having the sp. gr. smaller than the sp. gr. of the molten In 10 is floated on the molten In 10, then the rear surface of presolder is moved onto a scraper 8 to remove the oxides, etc., on the surface and to flatten the surface at the time of adhering the target plate 1 for forming the thin film of the ITO on a substrate by a sputtering method to the backing plate 2 made of copper. The rear surface of this target plate is transferred atop the backing plate 2 in the molten In 10 and is brought into pressurized contact therewith by a load 9, then the target plate is pulled up into the atm. by a lifting device 6 and is cooled, by which the target securely joined with the target plate 2 is obtd. |
