发明名称 |
Device for the electrical testing of electronic subassemblies |
摘要 |
The invention relates to a device for the electrical testing of electronic subassemblies by means of touch-pins which can be placed in any desired combination onto suitable contacting positions. In the device according to the invention, the touch-pins (1) are mounted and guided on a common carrier plate (3), the individual touch-pins (1) being arranged in a grid-shape in rows running at right angles to one another at the same respective predetermined distances from each other, and the common carrier plate (3) being mounted so as to be displaceable forwards and backwards in the direction of the parallel rows of touch-pins running at right angles to one another, in each case up to the distance between two touch-pins (1). In this case, all the touch-pins (1) are electrically interconnected and, in each test procedure, only one touch-pin (1) is respectively placed on a contacting position of the subassembly. By this means, rapid testing of modern subassemblies is possible. <IMAGE>
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申请公布号 |
DE3816019(A1) |
申请公布日期 |
1989.11.16 |
申请号 |
DE19883816019 |
申请日期 |
1988.05.10 |
申请人 |
SIEMENS AG, 1000 BERLIN UND 8000 MUENCHEN, DE |
发明人 |
LINDNER, ADALBERT;COPPENRATH, JUERGEN, 8000 MUENCHEN, DE |
分类号 |
G01R1/073 |
主分类号 |
G01R1/073 |
代理机构 |
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主权项 |
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地址 |
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