发明名称 Multilayer circuit board
摘要 The invention relates to a device for the wiring of supply voltages, earths and other circuit board parts such as, for example, controller configurations or databus systems, wherein measures are specified for achieving substantially simplified, fast and clear construction for a complex circuit which is made up of analog and digital technologies. <IMAGE>
申请公布号 DE3815736(A1) 申请公布日期 1989.11.16
申请号 DE19883815736 申请日期 1988.05.07
申请人 MESSERSCHMITT-BOELKOW-BLOHM GMBH, 8012 OTTOBRUNN, DE 发明人 FINKE, KLAUS, DIPL.-ING., 8170 BAD TOELZ, DE
分类号 H01R12/55;H05K1/00;H05K1/14;H05K3/22;H05K3/40;H05K3/46 主分类号 H01R12/55
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