The present invention provides a thermal transfer film which has been freed from phenomena of static charging, adhesion and spotting on the thermal head. This transfer film comprises a base film and an antistatic layer containing an inorganic polymer of a polysiloxane containing silanol groups or a polyelectrolyte of the quaternary ammonium type, and is applied to at least one side of the base film. A heat-fusible ink layer is applied to the other side of the base film.
