发明名称 |
Semiconductor device comprising leads. |
摘要 |
A semiconductor device includes a metallic electrode (4) formed on a semiconductor substrate (1), and a metallic terminal (11E) formed on a metal base through an insulating material, in parallel to the metal electrode (4). A metallic wire (12) electrically connects the metallic electrode to the metallic terminal. In a metallic conductor (23) having a current capacity larger than that of the metallic wire, one end is in contact with the metallic electrode, and the other end is in contact with the metallic electrode. |
申请公布号 |
EP0340466(A2) |
申请公布日期 |
1989.11.08 |
申请号 |
EP19890105967 |
申请日期 |
1989.04.05 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SAEKI, SHUZO C/O PATENT DIVISION;HIDESHIMA, MAKOTO C/O PATENT DIVISION |
分类号 |
H01L21/60;H01L23/049;H01L23/48;H01L23/495;H01L25/07;H01L25/18 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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