| 摘要 |
<p>PURPOSE:To reduce the number of members and to save time and labor cost for mounting by a method wherein a surface resistance film having a thermistor characteristic is formed on the surface of a chip base body, a rear resistance film used to correct a resistance-temperature characteristic of this surface resistance film is formed on the rear and they are connected in parallel. CONSTITUTION:A resistance film 7 composed of a metal oxide having a thermistor characteristic is formed on the surface of a chip base body 1; a surface electrode 8 is formed on the resistance film 7. A cut groove 9 is formed so as to cut the surface electrode 8 in an appropriate length, and a resistance value is adjusted. A rear resistance film 10 which is connected to rear electrodes 4, 5 is formed on the rear of the chip base body 1; a cut groove 11 used to adjust a resistance value is formed in the rear resistance film 10 in such a way that a temperature characteristic of the surface resistance film 7 is corrected linearly. End-face electrodes 14, 15 are formed on both end faces in the longitudinal direction of the chip base body 1; the surface resistance film 7 and the rear resistance film 10 are connected in parallel. By this setup, it is not required to attach a separate resistance which is used to correct the resistance- temperature characteristic; the number of components and the number of processes can be reduced.</p> |
