| 摘要 |
A printed circuit patchfield assembly comprising a plurality of electrical jack means arranged into a first and a second group are mounted in a front panel of the assembly. First and second double-sided printed circuit boards are provided in the assembly, the boards each having a first plurality of electrically conducting tracks on one side thereof and a second plurality of electrically conducting tracks on the other side thereof. A plurality of multi-contact electrical connectors are provided in a rear panel of the assembly and these are connected to the main springs of each of the jack means by the first plurality of conducting tracks. The first group of electrical jack means can be electrically connected to the second group by means of an internal connecting ribbon cable which connects the second plurality of conducting tracks on the first board with the second plurality of conducting tracks on the second board. The first and second plurality of conducting tracks on both boards are electrically connected by means of plated through-holes extending through the respective boards. Various normalling options between the first and second group of jack means can be selected by dimpling appropriate ones of conducting pads arranged on the printed circuit boards at the locations of the through-holes.
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